- When: May 28-31, 2019
- Where: The Cosmopolitan of Las Vegas, Las Vegas, NV, USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
Major topics
- Applied Reliability
- Assembly and Manufacturing Technology
- Emerging Technologies
- High-Speed, Wireless & Components
- Interconnections
- Materials & Processing
- Optoelectronics
- Thermal/Mechanical Simulation & Characterization
- Packaging Technologies (formerly Advanced Packaging)
- Photonics
- Interactive Presentations
If you have any questions, contact: Dr. Nancy Stoffel, 69th ECTC Program Chair GE Global Research 1 Research Circle, Niskayuna, NY 12309 Phone: +1-518-587-3429 E-mail: [email protected]
